ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

摘要

A method of forming an electronic device bond pad includes providing an electronic device substrate having an Al bond pad located thereover. An aluminum layer is formed over the Al bond pad. A metal layer is formed located between the Al bond pad and the aluminum layer. The metal layer comprises one or more of Ni, Pd and Pt and has a total concentration of Ni, Pd and/or Pt of at least about 50 wt. %. A gold bond wire may be attached to the aluminum layer.