发明名称 |
PRINTED CIRCUIT BOARD WITH GOOD PERFORMANCE ON IMPEDANCE |
摘要 |
A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction.
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申请公布号 |
US2012111626(A1) |
申请公布日期 |
2012.05.10 |
申请号 |
US201113290149 |
申请日期 |
2011.11.07 |
申请人 |
SU PING-SHENG;CHEN JUN;QI FENG-JUN;WANG QING;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
SU PING-SHENG;CHEN JUN;QI FENG-JUN;WANG QING |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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