NEW PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to a printed circuit board comprising a separation member where first and second conductive layers separable from each other are disposed in succession at each of the upper and lower surfaces of a separation-intended insulation member; a stacking-intended insulation member which is successively stacked at each of the upper and lower surfaces of the separation member; and a stacked body for printed circuit board formation which comprises a conductive layer stacked in succession at each of the upper and lower surfaces of the insulation member, and a method for manufacturing the same. According to the present invention, limitations in the applicability of typical single-layered printed circuit board structures may be overcome, and a new multi-layered printed circuit board supporting various designs such as a double-surface or an asymmetrical structure may be provided for higher productivity and economic feasibility.