| 摘要 |
PURPOSE: A surface mounting type semiconductor package, and a semiconductor package manufacturing system for a surface mounting technology and a method thereof are provided to bond a lid with a substrate, thereby increasing production efficiency. CONSTITUTION: A semiconductor device(150) is mounted on a flat substrate(110). A lid(130) has a cap shape. The lid covers the semiconductor device. The lid includes a concave part(131) which covers a bonding unit(133) and the semiconductor device. The concave part of the lid is closely to the semiconductor device. The bonding unit is bonded with a bonding surface(111) of the substrate. |
