| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an MEMS device capable of lowering a profile of the entire package thickness of the MEMS device while easing the stress to a MEMS element, provide a manufacturing method thereof, and provide a semiconductor device for having the MEMS device. <P>SOLUTION: The MEMS device includes: a substrate 102 having a first electrode 108a on at least one face side; an IC110 as a controlling element arranged on the same side as the first electrode is arranged; a movable part 133; an electrode pad 136, opposite to the first electrode of the substrate, for detecting or controlling a displacement of the movable part; an MEMS element arranged on the controlling element with the electrode pad exposed; and a connecting member 142 for joining electrically the first electrode of the substrate and the electrode pad of the MEMS element. The movable part is covered with the controlling element. <P>COPYRIGHT: (C)2012,JPO&INPIT |
