发明名称 |
METHOD OF MANUFACTURING PLATED RESIN PRODUCT, AND WAVEGUIDE |
摘要 |
<P>PROBLEM TO BE SOLVED: To perform plating with high adhesion onto an area where blasting treatment cannot be performed. <P>SOLUTION: The method includes: a soluble material addition procedure (step S1) of adding, to a main material, a soluble material selectively dissolved to the main material of a resin product; a molding procedure (step S2) of molding by use of the main material with the soluble material added thereto; a soluble material dissolving procedure (step S3) of dissolving the soluble material exposed onto the surface of the resin product; and a plating procedure (step S4) of performing metal plating on the resin product surface-roughed by the elution of the soluble material by the soluble material dissolving procedure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012087397(A) |
申请公布日期 |
2012.05.10 |
申请号 |
JP20100237607 |
申请日期 |
2010.10.22 |
申请人 |
NEC TOSHIBA SPACE SYSTEMS LTD |
发明人 |
MATSUNO YUJI;YAMASHITA AKIRA |
分类号 |
C23C18/26 |
主分类号 |
C23C18/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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