发明名称 METHOD OF MANUFACTURING PLATED RESIN PRODUCT, AND WAVEGUIDE
摘要 <P>PROBLEM TO BE SOLVED: To perform plating with high adhesion onto an area where blasting treatment cannot be performed. <P>SOLUTION: The method includes: a soluble material addition procedure (step S1) of adding, to a main material, a soluble material selectively dissolved to the main material of a resin product; a molding procedure (step S2) of molding by use of the main material with the soluble material added thereto; a soluble material dissolving procedure (step S3) of dissolving the soluble material exposed onto the surface of the resin product; and a plating procedure (step S4) of performing metal plating on the resin product surface-roughed by the elution of the soluble material by the soluble material dissolving procedure. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012087397(A) 申请公布日期 2012.05.10
申请号 JP20100237607 申请日期 2010.10.22
申请人 NEC TOSHIBA SPACE SYSTEMS LTD 发明人 MATSUNO YUJI;YAMASHITA AKIRA
分类号 C23C18/26 主分类号 C23C18/26
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