CENTERING DEVICE OF WAFER, CHAMFERING DEVICE AND CENTERING METHOD OF WAFER

摘要

PROBLEM TO BE SOLVED: To provide a low-cost centering device of simple structure capable of centering a wafer with high accuracy, and to provide a chamfering device using it.

SOLUTION: When a positioning cup 13 moves upward relative to a support 14 supporting a wafer W, the wafer W is supported by the tapered surface 11 of the positioning cup 13. When the wafer W is supported, the wafer W is slid on the tapered surface 11 with a vibration applied by a vibrator 12 and positioned. When the positioning cup 13 moves downward relative to the support 14, the positioned wafer W is supported by the support 14 and the wafer W is centered by the centering device 10 of the wafer W.

COPYRIGHT: (C)2012,JPO&INPIT