| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of electronic components to which thermal countermeasures and EMC countermeasures are concurrently applied. <P>SOLUTION: A mounting structure of electronic components includes a shield box which opens at one surface and has protrusions at edge parts, heating components formed so as to have a thickness smaller than the depth of the shield box, lead parts formed in the heating components, and a potting material filling in the shield box. The lead parts of the heating components are formed so as to protrude from the edge parts of the shield box when the heating components are disposed on a bottom part of the shield box, and the potting material fills the shield box so as not to cover surfaces of the heating components. <P>COPYRIGHT: (C)2012,JPO&INPIT |
