| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device capable of reducing costs such as a material cost by reducing an amount of Au in the tape carrier for the semiconductor device and the method for manufacturing the same. <P>SOLUTION: The tape carrier for the semiconductor device is provided with a conductor pattern containing a flying lead section formed by carrying out a pattern processing of a copper (Cu) foil. The tape carrier for the semiconductor device also comprises an Au plated film only on the flying lead section in the conductor pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT |
