| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide image sensor package structure. <P>SOLUTION: Image sensor package structure comprises: a substrate 110; a chip 120; a transparent plate 130; a first casing 140; and a sealing body 150. The chip formed with a photosensitive region 124 is coupled onto the substrate, the transparent plate 130 covers the photosensitive region of the chip and is bonded on the chip, and the first casing 140 having an opening with respect to the photosensitive region is bonded on the transparent plate. Since the sealing body 150 covers and seals the surroundings of the chip and the transparent plate, and an adhesive layers 160 and 180 between the transparent plate and the chip, a passage through which water content intrudes the photosensitive region is elongated and reliability of the image sensor package structure is enhanced. <P>COPYRIGHT: (C)2012,JPO&INPIT |
