发明名称 |
RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE |
摘要 |
An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 μm to 10 μm, boehmite particles having an average particle diameter of 0.2 μm to 5 μm, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.
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申请公布号 |
US2012111621(A1) |
申请公布日期 |
2012.05.10 |
申请号 |
US201013386135 |
申请日期 |
2010.07.21 |
申请人 |
OHIGASHI NORIYUKI;MORI SEIJI;MURAKAMI HARUO;TOBISAWA AKIHIKO;OBATA HIROSHI;MASAKI TAKAYOSHI;SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
OHIGASHI NORIYUKI;MORI SEIJI;MURAKAMI HARUO;TOBISAWA AKIHIKO;OBATA HIROSHI;MASAKI TAKAYOSHI |
分类号 |
H05K1/00;B32B15/092;B32B27/38;B82Y30/00;C08K3/36;C08L63/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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