METHODS AND APPARATUS FOR DISPLACING FLUIDS FROM SUBSTRATES USING SUPERCRITICAL CO2

摘要

A processing chamber for post-wet-etch removing of drying fluid (DF) is disclosed. The chamber includes a chamber wall surrounding a processing volume and a plurality of nozzles disposed annularly about the processing volume and arranged into a set of nozzle rows that includes at least one nozzle row. The chamber also includes a plenum and a set of manifolds coupled to the plurality of nozzles to deliver the supercritical CO2 to the plurality of nozzles. Each nozzle has a nozzle outlet directed toward an interior portion of the processing volume and the nozzles are configured to flow the supercritical CO2 toward the substrates in a manner that minimizes recirculation loops and vortices.