COOLING DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The disclosed cooling device uses the boiling cooling method and is provided with protrusions to promote convective heat transfer to an evaporation unit. Since a configuration in which bubble nuclei are formed on an inner wall surface on the contrary reduces cooling performance, the disclosed cooling device is provided with an evaporation unit for storing a cooling medium, a condenser unit for condensing and liquefying the gas-phase cooling medium gasified in the evaporation unit and dissipating the heat, and a linking unit for linking the evaporation unit and the condensing unit. The evaporation unit is provided with a base unit in thermal contact with the object to be cooled, and a container unit. The base unit is provided with multiple protrusions on the boiling surface, that is, the surface on the side of the inner wall in contact with the cooling medium. The protrusions are configured such that the size of the cross-sectional area of said protrusions when cut at the ends thereof in a plane parallel to the boiling surface is less than the area of the boiling surface, and the protrusions are provided with a bubble nuclei forming surface at only one portion of the cooling medium contact surface comprising the boiling surface and the surface of the protrusions.