SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE

摘要

[Problem] To improve the flatness of the surfaces of insulating layers between deposited wiring layers and to stabilize the impedance in the wiring layers. [Solution] A suspension substrate (1) is provided with a metal substrate (20), a first insulating layer (22) provided on the metal substrate (20), a first wiring layer (10) provided on the first insulating layer (22), a second insulating layer (24) provided on the first insulating layer (22) and the first wiring layer (10), and a second wiring layer (12) provided on the second insulating layer (24). The second wiring layer (12) is covered by a protective layer (26). When T1 is the total of the thickness of the first wiring layer (10) and the thickness of the second insulating layer (24) on the first wiring layer (10), and T2 is the thickness of the second insulating layer (24) at a position which is separated by a specific distance from the first wiring layer (10) and is where the surface of the second insulating layer (24) is flat, T1 - T2 < 4.5 µm is satisfied.