PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS

摘要

PURPOSE: Photo-sensitive compositions, a method for manufacturing patterns, the structure of microelectromechanical systems(MEMS), a method for manufacturing the structure, a dry etching method, a wet etching method, and MEMS shutter devices, and image display devices are provided to form rectangular profiles or almost rectangular profiles after patterns are baked. CONSTITUTION: Photo-sensitive compositions for etching resist include polymers, photo acid generators, and solvents. The polymers include a first monomer unit and a second monomer unit. The first monomer unit includes a residue in which carboxyl groups or phenolic groups are protected by acid decomposable groups. The second monomer unit includes epoxy group and/or ocetanyl group. The photo-sensitive compositions form a section shape of 70 degrees or more of a tapered angle after a baking process for baking patterns(12). The average molecular weight of the polymers is more than or equal to 20,000. The photo-sensitive compositions include heat cross-linkers.