发明名称 |
COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME AND LAMINATED BOARD |
摘要 |
A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5μm in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5μm in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.
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申请公布号 |
US2012111613(A1) |
申请公布日期 |
2012.05.10 |
申请号 |
US201013384084 |
申请日期 |
2010.07.07 |
申请人 |
OGURO RYOICHI;KASE KOUJI;HOSHINO KAZUHIRO;FURUKAWA ELECTRIC CO., LTD. |
发明人 |
OGURO RYOICHI;KASE KOUJI;HOSHINO KAZUHIRO |
分类号 |
H05K1/09;B32B15/01;B32B15/04;C23C28/02;H05K1/02 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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