| 摘要 |
An objective of the present invention is to improve heat radiation performance of power circuit components which configure a power module (100), to improve heat emitting balance therewith, and to cause same to radiate heat efficiently with respect to the heat tolerance of each respective component. Power circuit components, further comprising power switching elements (107, 108) which configure bridge circuits, and motor relay switching elements (109), are mounted on an electroconductive member (102) with heat emitting balance maintained. The electroconductive member (102) is positioned in contact with a heat sink (30) for heat radiation, and the power circuit components and the heat sink (30) are formed in a single unit with a mold resin (101). |
