POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A power module using plastic bonding and a manufacturing method thereof are provided to improve a heat radiation property by easily emitting heat generated during a power module operation through a device lower portion. CONSTITUTION: A circuit layer(20) including a wiring pattern(21) and an electrode pattern(23) is formed on a substrate(10). A device(40) is loaded on the wiring pattern of the circuit layer. A plasticity bonding layer(30) is formed by spreading metal paste between the wiring pattern and the device. A lead frame(60) electrically connects the device and the electrode pattern. A solder bonding layer(50) bonds one end of the device and the lead frame the other end of the electrode pattern and the lead frame.