HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A heat radiation substrate and a manufacturing method thereof are provided to improve heat dissipation by controlling a ratio of a Cu layer and an Al layer. CONSTITUTION: An aluminum layer(120) is formed on the upper and lower sides of a copper layer(110). An anode oxidation insulation layer(130) is formed on the surface of the aluminum layer. A seed layer is formed on the anode oxidation insulation layer. A metal layer(150) is formed on a seed layer(140). A pattern is formed by partially removing the seed layer and the metal layer.