| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of cleaning a semiconductor wafer effectively with a small usage of ammonia. <P>SOLUTION: Ammonia water includes microbubbles that are generated in the ammonia water obtained by adding ammonia to pure water with an electric conductivity of 1 μS/cm or less so that its concentration becomes 0.005-0.5%, that have a particle diameter of 50 μm or less, and that have a peak of the particle diameter at 10-15 μm in measurement by a counter for particles in liquid of a laser beam blocking system, and the number of which in the peak region is 1000/mL or more, and that contain air and/or inert gas. The cleaning is performed by contacting the ammonia water with a surface of a semiconductor wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
