CURABLE RESIN COMPOSITION AND CURED ARTICLE

摘要

This curable resin composition comprises (A) a ladder-type silsesquioxane having an aliphatic carbon-carbon double bond in the molecule, (B) a ladder-type silsesquioxane having an Si-H bond in the molecule, and a hydrosilylation catalyst. The curable resin composition is useful as a sealing agent for an optical semiconductor element or the like. This cured article is produced by curing the curable resin composition. The curable resin composition of the present invention enables the production of a cured article having physical properties including high-temperature heat resistance, flexibility, transparency, thermal yellow discoloration resistance and optical yellow discoloration resistance.