| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device having suppressed nearest-neighbor coupling capacity, and an electric apparatus having the solid-state imaging device, such as a camera. <P>SOLUTION: A solid-state imaging device comprises: a stacked semiconductor chip in which semiconductor chips are bonded, a pixel array and a first multilayer wiring layer are formed on a first semiconductor chip, and a logic circuit and a second multilayer wiring layer are formed on a second semiconductor chip; a plurality of connection wiring 67 connecting between the semiconductor chips; and a first shield wiring 113 shielding between the connection wiring 67 adjacent in one direction. Each connection wiring 67 has a connection conductor 68 that is connected to a first connection pad connected to a required first wiring in the first multilayer wiring layer and a through connection conductor 69 that penetrates through the first semiconductor chip and is connected to a second connection pad connected to a required second wiring in the second multilayer wiring layer. The connection wiring 67 is formed with a coupling conductor for coupling the connection conductor 68 and the through connection conductor 69. The solid-state imaging device is configured as a back-illuminated solid-state imaging device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
