| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad which can combine enhancement of planarity of a polished surface and reduction of polishing defects (scratch) in the CMP, and to provide a chemical mechanical polishing method using the chemical mechanical polishing pad. <P>SOLUTION: The chemical mechanical polishing pad has a polishing layer formed of a plurality of layers. The polishing layer has at least a first layer having a polishing surface that comes in contact with a polished article when chemical mechanical polishing is performed, and a second layer that is in contact with the first layer on the surface facing the polishing surface of the first layer. The duro D hardness (D1) of the first layer measured after immersing into water of 23°C for one hour and the duro D hardness (D2) of the second layer measured without immersing into water satisfy a relation D1<D2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
