发明名称 FLEXURE SUBSTRATE WITH WIRING, METHOD FOR MANUFACTURING FLEXURE SUBSTRATE WITH WIRING, FLEXURE WITH WIRING, FLEXURE WITH WIRING WITH ELEMENT AND HARD DISK DRIVE
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexure substrate with wiring which has no disconnection failure and can be easily formed. <P>SOLUTION: The flexure substrate with wiring has: a laminated wiring formation part having a first insulator layer, a first conductor layer formed on the first insulator layer, a second insulator layer formed on the first conductor layer, and a second conductor layer formed on the second insulator layer so as to overlap the first conductor layer in a thickness direction; and a terminal formation part formed at an end part of the wiring formation part to have a first terminal part arranged on the first insulator layer to be connected to the first conductor layer, and a second terminal part arranged on the first insulator layer to be connected to the second conductor layer. In the flexure substrate with wiring, a pillow part made of the same material as that of the first conductor layer and insulated from the first conductor layer is formed a connection region for connecting the second conductor layer and the second terminal part, and the second conductor layer and the second terminal are connected through a pillow part conductor layer formed on the pillow part. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012089204(A) 申请公布日期 2012.05.10
申请号 JP20100235306 申请日期 2010.10.20
申请人 DAINIPPON PRINTING CO LTD 发明人 OTA TAKAYUKI
分类号 G11B21/21;G11B5/60 主分类号 G11B21/21
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