| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method enabling accurate and easy confirmation of a connecting state of an electronic component with a substrate when manufacturing an electronic device constituted by mounting the electronic component in which an electrode is formed on the back face side to the substrate. <P>SOLUTION: In a land forming process, a first land part 6a is formed in a position covered with a back face electrode 2 when mounted, and a second land part 6b having a width narrower than that of the first land part 6a is formed in an outer position which extends from the first land part 6a and is not covered with the back face electrode 2 when mounted. In a solder paste printing process, solder paste 4 covering a land 6 in a configuration astride the first land part 6a and the second land part 6b is printed. After the solder paste 4 is printed, a reflow process is performed. In the reflow process, with the back face electrode 2 disposed in a position corresponding to the first land part 6a, the solder paste 4 is molten, and jointing is performed while at least part of the solder paste 4 on the second land part 6b side is moved to the back face electrode 2 side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
