A curable one-part epoxy resin composition is described. The composition comprises an epoxy component comprising at least one epoxy compound which has two or more groups per molecule; a latent hardener component; a thixotropy-conferrring component; a polythiol component comprising a polythiol having at least one secondary or tertiary thiol group per molecule; and a stabilising component comprising a solid organic acid. The compositions according to the invention are particularly suitable for use in the field of microelectronics.
申请公布号
WO2012059558(A1)
申请公布日期
2012.05.10
申请号
WO2011EP69366
申请日期
2011.11.03
申请人
LOCTITE (R&D) LIMITED;BURNS, BARRY, N.;WIGHAM, JONATHAN, P.