| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a filmy sealing agent that is useful for sealing tightly an electronic device at low temperatures, and to provide a sealing method by using this sealing agent. <P>SOLUTION: The sealing method is characterized in that the filmy sealing agent containing a copolyamide-based resin is made to cover at least one part of a device, and that the sealing agent is then melted by heat and cooled to thereby cover and seal the device. The copolyamide-based resin has a melting point or softening point of 75-160°C and may have the crystallizability. The copolyamide-based resin may be a multi-component copolymer and may contain a unit derived from an 8C-16C alkylene group-containing long-chained component (9C-17C lactam, 9C-17C alkanecarboxylic acid, or the like). This filmy sealing agent may cover the one side surface of the device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
