| 摘要 |
1,214,894. Electronic component housings. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 20 June, 1968 [23 June, 1967], No. 29464/68. Heading H1K. To ensure an even deposition of plating metal in a method of electroplating one or more metal parts 24, 25 of an envelope for electronic components and conductors which are connected in a frame 23 and pass through the envelope in an insulated manner, flexible lugs 21, 22 are provided on the frame 23 so that they may be bent into contact with the metal parts of the envelope to ensure that all parts to be plated are electrically connected. The envelope and its conductors are then immersed in liquid electrolyte and plated, after which the frame 23 and flexible lugs 21, 22 are removed. The non-metal parts of the envelope are of glass and the metal parts are of an iron-nickel-cobalt alloy, such as for example 28-29% nickel, 16-19% cobalt and 52-56% iron. Plating metals used are gold, silver, copper or nickel. |
