发明名称 METHOD FOR INTERCONNECTING A CONDUCTIVE PAD AND AN ELECTRICAL CONTACT VIA A SPRING, AND CORRESPONDING DEVICE
摘要 <p>The invention relates to a device having an integrated-circuit chip, and including an insulating body (2) containing at least one conductive pad (3, 4), at least one electrical contact (5, 6) opposite said electrically conductive pad, at least one recess (7, 8) provided in the body, including a bottom (9, 10) and one aperture (11, 12), said recess being connected, at the bottom thereof, to the conductive pad (3, 4) and, at the aperture thereof, to the electrical contact (5, 6). The device further includes at least one coil spring (12, 13) arranged in the recess (8) and connecting the conductive pad to the electrical contact. The device is characterized in that it includes means (8, 16, 42) configured to facilitate the installation of the spring in the recess thereof and to support same at least by means of the friction of the central portion (C) of the spring relative to the walls of the recess thereof. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite said electrically conductive pad.</p>
申请公布号 WO2012059557(A1) 申请公布日期 2012.05.10
申请号 WO2011EP69365 申请日期 2011.11.03
申请人 GEMALTO SA;BAJOLLE, ANTOINE;SEBAN, FREDERICK;LEIBENGUTH, JOSEPH;ROUSSEL, FRANCOIS;FIDALGO, JEAN-CHRISTOPHE 发明人 BAJOLLE, ANTOINE;SEBAN, FREDERICK;LEIBENGUTH, JOSEPH;ROUSSEL, FRANCOIS;FIDALGO, JEAN-CHRISTOPHE
分类号 G06K19/077 主分类号 G06K19/077
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