发明名称 LIGHT EMITTING DIODE EMBEDDED PRINTED CIRCUIT BOARD HAVING
摘要 PURPOSE: A light emitting diode embedded printed circuit board is provided to improve mounting density by making the thickness of a component thin through lowering the mounting height of the printed circuit board and an LED. CONSTITUTION: In a light emitting diode embedded printed circuit board, a cavity is formed in a first resin layer(113). A metal layer is laminated in the lower part of the first resin layer. An LED unit(130) is mounted in a cavity and is electrically connected to the metal layer The LED unit includes a molding resin(131) in which the LED radiating light is mounted and also includes an electrode. A second resin layer(115) is interposed between the first resin layer and a metal layer.
申请公布号 KR101144202(B1) 申请公布日期 2012.05.10
申请号 KR20090104898 申请日期 2009.11.02
申请人 发明人
分类号 H01L33/54 主分类号 H01L33/54
代理机构 代理人
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