发明名称 Forming Method For Polymeric Laminated Wafers Comprising Different Film Materials
摘要 A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials.
申请公布号 US2012113523(A1) 申请公布日期 2012.05.10
申请号 US201113192399 申请日期 2011.07.27
申请人 SUGIMURA HIDEYO 发明人 SUGIMURA HIDEYO
分类号 G02B1/00;B29D11/00 主分类号 G02B1/00
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