| 摘要 |
Provided is a test wafer that tests a plurality of semiconductor chips that are formed on a semiconductor wafer and that each include an operation circuit and an internal memory. The test wafer comprises a plurality of test circuits that correspond to the plurality of semiconductor chips, supply the operation circuits of the corresponding semiconductor chips with measurement signals, and measure electrical characteristics of signals output by the operation circuits in response to the measurement signals; and a plurality of write circuits that correspond to the plurality of semiconductor chips and each write, to the internal memory of the corresponding semiconductor chip, data corresponding to a measurement result of the corresponding test circuit.
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