| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat radiation of a semiconductor radiation sensor. <P>SOLUTION: A semiconductor radiation sensor (10) has a truncated cone shape having a p-plane electrode side bottom face (10p), an n-plane electrode side bottom face (10n), and a peripheral surface (10s). The peripheral surface (10s) is tapered. A semiconductor radiation sensing device (100) holds the semiconductor radiation sensor (10) with a tapered face (11s) of a BN holder (11) and a metal ring (13). The metal ring (13) is brought into close contact with the p-plane electrode side bottom face (10p). The peripheral surface (10s) of the semiconductor radiation sensor (10) is brought into close contact with the tapered face (11s) of the BN holder (11). Heat generated from the semiconductor radiation sensor (10) is excellently radiated from a part of the p-plane electrode side bottom face (10p) and the peripheral surface (10s) of the semiconductor radiation sensor (10). Thus the heat radiation from the semiconductor radiation sensor (10) is improved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
