| 摘要 |
The present invention relates to an LED package and to a method for manufacturing the LED package. The LED package of the present invention comprises: a substrate; an LED chip, which is mounted onto the substrate and emits light; a reflecting unit, which is disposed around the LED chip and has an open top portion with an upwardly increasing cross section; a transparent resin, which fills the inside of the reflecting unit to protect the LED chip; and a fluorescent substance for changing the color of the light which is emitted from the LED chip, wherein the fluorescent substance is sprayed on the inside of a triangle having vertexes formed at the edge of the upper end of the LED chip, the upper end of the reflecting unit and where the horizontal extension of the upper end of the LED chip meets the reflecting unit, or on the inside of a trapezoid having vertexes at the edges of both sides of the upper end of the LED chip and at both sides of the upper end of the reflecting unit. |
