发明名称 |
IN-PACKAGE MICROELECTRONIC APPARATUS, AND METHODS OF USING SAME |
摘要 |
A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s. |
申请公布号 |
US2012113704(A1) |
申请公布日期 |
2012.05.10 |
申请号 |
US201213354708 |
申请日期 |
2012.01.20 |
申请人 |
DATTAGURU SRIRAM;WOOD LESLEY A. POLKA;TOMITA YOSHIHIRO;ICHIKAWA KINIYA;SANKMAN ROBERT L. |
发明人 |
DATTAGURU SRIRAM;WOOD LESLEY A. POLKA;TOMITA YOSHIHIRO;ICHIKAWA KINIYA;SANKMAN ROBERT L. |
分类号 |
G11C5/02;H01L23/48 |
主分类号 |
G11C5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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