| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package and a method of manufacturing the same. <P>SOLUTION: At least one of a substrate insulation layer and a chip insulation layer includes a dummy opening. During a self-assembly solder bonding process for flip chip bonding, dummy solder is formed by filling the dummy opening with solder particles which do not become an inner solder ball connecting a substrate connection terminal to a chip connection terminal, and remains on a peripheral region. Therefore, problems such as electrical short circuit and leakage current by remaining solder particles can be solved, so that a reliable semiconductor package can be provided. Since the dummy opening is formed to expose a predetermined portion of a circuit pattern, which is a signal transmission path, a dummy metal pattern does not need to be formed purposely, and a signal wiring design of a circuit board does not need to be changed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
