| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for preventing charged dusts and solder chips from being accumulated, adhered and clogged on an inner face of a suction hole of a vacuum suction nozzle. <P>SOLUTION: A vacuum suction nozzle 1 comprises a substrate having a suction face 2 at a tip, and a suction hole 3 communicated with the suction face 2 through the substrate. A tip end of the substrate including at least the suction face 2 is made of ceramics, and a plurality of projections with an electric resistance smaller than that of a main component of the ceramics are formed on the inner face of the suction hole 3. Even when static electricity is applied to the dusts and the solder chips sucked from the suction hole 3 at the same time as electronic components are sucked, the static electricity is discharged by contacting the projections, so as to prevent the dusts and the solder chips from being adhered and accumulated on the inner face due to static electricity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
