| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a water-based cutting fluid for silicon ingot, excellent in low foamability in a cutting process of silicon ingots, excellent in cleaning performance in a cleaning process of silicon wafers obtained by cutting, and further bringing an excellent flatness to the silicon wafer after cutting. <P>SOLUTION: The water-based cutting fluid for silicon ingot contains as essential components, water and a polyoxyalkylene compound (A) having HLB of 6 to 20 represented by general formula (1) [wherein R is 1-8C alkyl; m is 1 to 10 of average addition number of moles of ethylene oxide; n is 0 to 5 of that of propylene oxide; m/(m+n) is 0.4 to 1.0; and the addition conditions of ethylene oxide and propylene oxide may be block or random]. The water content of the water-based cutting fluid when in use is 70-99.99 wt.% based on total of the cutting fluid. <P>COPYRIGHT: (C)2012,JPO&INPIT |
