| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicon target material in which particles are not easily generated during a sputtering process, and to form a low-defect (high quality) silicon-containing film. <P>SOLUTION: The silicon target material having a specific resistance of 20 Ω cm or more at room temperature is used for forming a silicon-containing film. The silicon target material may be polycrystalline or noncrystalline. However, when the silicon target material is single-crystalline, a more stable discharge state can be obtained as an advantage. Also, a single-crystal silicon in which crystals are grown by an FZ method is a preferable material as a highly-pure silicon target material because its content of oxygen is low. Further, a target material having n-type conductivity and containing donor impurities is preferable to obtain stable discharge characteristics. Only a single or a plurality of silicon target materials may be used for sputtering film formation of the silicon-containing film. Furthermore, the sputtering film formation of the silicon-containing film may be performed by simultaneously using a silicon target material, a transition metal and silicon-containing target material or by simultaneously using a silicon target material and a transition metal target material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
