发明名称 BUTTED SOI JUNCTION ISOLATION STRUCTURES AND DEVICES AND METHOD OF FABRICATION
摘要 A structure, a FET, a method of making the structure and of making the FET. The structure including: a silicon layer on a buried oxide (BOX) layer of a silicon-on-insulator substrate; a trench in the silicon layer extending from a top surface of the silicon layer into the silicon layer, the trench not extending to the BOX layer, a doped region in the silicon layer between and abutting the BOX layer and a bottom of the trench, the first doped region doped to a first dopant concentration; a first epitaxial layer, doped to a second dopant concentration, in a bottom of the trench; a second epitaxial layer, doped to a third dopant concentration, on the first epitaxial layer in the trench; and wherein the third dopant concentration is greater than the first and second dopant concentrations and the first dopant concentration is greater than the second dopant concentration.
申请公布号 US2012112280(A1) 申请公布日期 2012.05.10
申请号 US20100943084 申请日期 2010.11.10
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 JOHNSON JEFFREY B.;NARASIMHA SHREESH;NAYFEH HASAN M.;ONTALUS VIOREL;ROBISON ROBERT R.
分类号 H01L29/06;H01L21/336;H01L29/78 主分类号 H01L29/06
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