| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting substrates, a package including cavity and a heat sink, and a method for packaging the same. <P>SOLUTION: A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces 100a and 100b. The first metal face 100a includes a cavity 110, which is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein in the direction away from the cavity 110. The second metal face 100b includes a plurality of heat sink fins 190 therein. One or more semiconductor light emitting devices are mounted in the cavity 110. Reflective coatings, conductive traces, insulating layers may be provided in the package. <P>COPYRIGHT: (C)2012,JPO&INPIT |
