发明名称 DEPOSITION METHOD, DEPOSITION EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a deposition method for forming a good-quality MB<SB POS="POST">x</SB>film (M indicates Zr or Hf and x indicates a number of 1.8 to 2.5) having an M/Zr ratio in an appropriate range using an M(BH<SB POS="POST">4</SB>)<SB POS="POST">4</SB>as a raw material by a thermal CVD method. <P>SOLUTION: In a deposition method, an H<SB POS="POST">2</SB>gas is supplied from a gas supply source 19 into a material container 21 through a gas supply pipe 15a. The contact with the introduced H<SB POS="POST">2</SB>gas allows a Zr(BH<SB POS="POST">4</SB>)<SB POS="POST">4</SB>as a solid raw material to be evaporated in the material container 21. A mixed gas of the H<SB POS="POST">2</SB>gas and the Zr(BH<SB POS="POST">4</SB>)<SB POS="POST">4</SB>gas as a deposition gas is introduced into a processing container 1 through gas supply pipes 15c and 15c1, a gas diffusing space 12 of a shower head 11 and a gas-ejecting hole 13 to form a thin film of a ZrB<SB POS="POST">x</SB>film so as to cover a surface of an insulating film on a wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012089546(A) 申请公布日期 2012.05.10
申请号 JP20100232276 申请日期 2010.10.15
申请人 TOKYO ELECTRON LTD 发明人 KOMIYA TAKAYUKI
分类号 H01L21/205;C01B35/00;C23C16/38;H01L21/28;H01L21/285;H01L21/3205;H01L23/52 主分类号 H01L21/205
代理机构 代理人
主权项
地址