发明名称 LIGHT-EMITTING DIODE WITH HEAT SINK-FIN
摘要 A light emitting diode having a heat radiating fin is provided to prevent heat from being transferred to a lead part by installing a heat radiating fin in a light emitting diode. An insulation layer is formed on a metal slug. A light emitting chip is mounted on the insulation layer of the metal slug. A lead is formed on the insulation layer of the metal slug, electrically connected to the light emitting chip. The outer surface of the metal slug is surrounded by a housing(40). A heat radiating fin penetrates the slug to be positioned near the metal slug, made of metal. A pair of leads(60a,60b) and a pair of heat radiating fins(50a,50b) are interconnected and incorporated.
申请公布号 KR101142940(B1) 申请公布日期 2012.05.10
申请号 KR20050053809 申请日期 2005.06.22
申请人 发明人
分类号 H01L33/64 主分类号 H01L33/64
代理机构 代理人
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