SOLDER BALL AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a solder ball in which an underfill part is formed so as to cover the outside of a core part, and a semiconductor package in which a substrate part and a semiconductor chip are electrically connected to each other via the solder ball.

SOLUTION: A solder ball 130 for electrically connecting a semiconductor chip 110 and a substrate part 120 includes: a core part 132 for electrically connecting the semiconductor chip 110 and the substrate part 120; and an underfill part 134 applied to the core part 132 so as to cover the outside of the core part 132 for protecting the periphery of the core part 132 when the semiconductor chip 110 and the substrate part 120 are brought into contact with each other in the core part 132.

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