| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which enhancement of performance, cost reduction and enhancement of the yield are achieved, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device consists of stacked semiconductor chips each having a plurality of terminals for sending/receiving information or power to/from the outside. The terminals are arranged in at least one row, and each terminal is provided with a first region with which a test probe comes into contact, and a second region to which wiring for sending/receiving information or power to/from the outside is connected. In the state where the terminals are arranged in one row, the first regions and second regions are arranged in zigzag. <P>COPYRIGHT: (C)2012,JPO&INPIT |
