| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an embedded printed circuit board with improved density by realizing an embedded printed circuit board with a constant insulation distance for keeping the electrical characteristics of the printed circuit board constant and solving a distortion problem. <P>SOLUTION: A manufacturing method for an embedded printed circuit board includes: (A) a step of forming a first structure body 110 in which a first metal layer 112, a first cured insulation layer 114, and a first semi-cured insulation layer 116 are stacked in order and a second structure body 120 in which a second metal layer 122, a second cured insulation layer 124, and a second semi-cured insulation layer 126 are stacked in order; (B) a step of stacking an inner layer base 130 including a cavity 132 on the first semi-cured insulation layer 116 and fixing an electronic element 140 on a surface of the first semi-cured insulation layer 116 so as to be located in the cavity 132; and (C) a step of arranging the first semi-cured insulation layer 116 and the second semi-cured insulation layer 126 so as to face each other and embedding the electronic element 140 by crimping the first structure body 110 and the second structure body 120 in a direction toward the inner layer base 130. <P>COPYRIGHT: (C)2012,JPO&INPIT |
