| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which satisfies heat resistance and chemical resistance and is extremely excellent in the adhesion strength on a resin substrate and the insulating property (surface resistance) of the resin surface after etching, and to provide a copper-clad laminate sheet which satisfies all of the adhesion strength, heat resistance, chemical resistance and etching property. <P>SOLUTION: The surface-treated copper foil includes a surface treatment layer composed of an Ni-Zn alloy layer. The Zn content of the Ni-Zn alloy layer is 5% or more and 21% or less, and the Zn concentration in the alloy layer has a concentration gradient of decreasing the concentration from the raw copper foil side to the surface of the surface treated layer, the adhesion amount of Zn is 0.07 mg/dm<SP POS="POST">2</SP>or more, and the adhesion amount of Ni is 0.4 mg/dm<SP POS="POST">2</SP>or more and 2.9 mg/dm<SP POS="POST">2</SP>or less. The copper-clad laminate sheet includes the surface-treated copper foil adhered to a resin substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
