Applying an electrically conductive and optically transparent metal layer, by depositing a metal layer on the surface of the substrate under vacuum with an electric arc discharge that is connected between targets as a cathode

摘要

The method comprises depositing a metal layer on the surface of the substrate under vacuum with an electric arc discharge that connects between targets as a cathode, where the metal layer is formed from the metal. An anode is formed, and an electric current is operated by 1.5 KA. The ions serving in the arc discharge formed for the deposition of metal layer are filtered through a filter in which larger particles are separated. The diffusion of the ions on the substrate surface is reduced by subplantation of the ions in the substrate. The method comprises depositing a metal layer on the surface of the substrate under vacuum with an electric arc discharge that connects between targets as a cathode. An anode is formed, and an electric current is operated by 1.5 KA. The ions serving in the arc discharge formed for the deposition of metal layer are filtered by a filter in which larger particles are separated. The diffusion of the ions on the substrate surface is reduced by subplantation of the ions in the substrate. The electrically conductive and optically transparent metal layer has a layer thickness of less than 20 nm on a substrate. The ions with kinetic ion energies are directed by 25 eV on the surface to be coated. The ions generated in the arc discharge are filtered by a change of its movement vector within a magnetic field and separated by the larger particles. The ions are produced with a pulsed operated electric arc. The method is repeated for a pulse length of the pulsed electric arc of less than 10-100 ms and the pulsed electric arc having a frequency of 0.1-1000 Hz. An additional optically transparent dielectric layer is deposited on the metal layer. A sequence of additional optically transparent dielectric layers and optically transparent metal layers is deposited by the layer thicknesses formed as an interference layer system on the substrate surface. The layers in a layer plane structure is/are separated. An independent claim is included for a substrate with an optically transparent and electrically conductive metal layer.