| 摘要 |
PURPOSE: A laminated semiconductor package is provided to simplify a process for electrically connecting a lower package and an upper package, thereby easily manufacturing the laminated semiconductor package. CONSTITUTION: A lower package comprises a first substrate, a first semiconductor chip(220), a first terminal(240), and a first molding member(250). The first terminal is electrically connected to the first semiconductor chip. The first molding member molds the first semiconductor chip and the first substrate. An upper package comprises a second substrate, a second semiconductor chip, a second terminal, a package terminal, and a second molding member. The package terminal comprises a terminal extension part which electrically connects the first terminal and the second terminal.
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