| 摘要 |
A semiconductor device of the present invention includes a semiconductor chip, a die pad to which the semiconductor chip is bonded with solder to be mounted thereon, a plurality of leads electrically conducted to the semiconductor chip, a stress reducing layer that is provided on a rear face of the die pad opposite to a face of the die pad on which the semiconductor chip is mounted and that reduces stress applied to the semiconductor chip, and a sealing body for sealing at least the semiconductor chip. |
